Magnetron Sputtering
A physical vapor deposition (PVD) technique utilizing magnetically confined glow discharge plasma to sputter target material onto substrates.
Governing formula
E × B Electron Trapping drift path near cathode target
SI unit
nm/s (Deposition Rate)
In depth
Permanent magnets placed behind a cathode target create an E × B electron trap. Confined secondary electrons increase gas ionization density, generating intense argon ion bombardment that sputters target atoms onto substrates.
Examples in the real world
Depositing anti-reflective optical coatings on eyeglasses and metallic thin films on microelectronics.